Appeal No. 2001-0687
Application No. 09/080,070
1. A method of making a ball grid array package comprising
the steps of:
(a) providing a partially fabricated package having a
semiconductor die having die pads, leads and balls secured to
predetermined ones of said leads;
(b) then coating said leads and said balls with palladium;
and
(c) then encapsulating said die, leads and at least a
portion of each of said balls.
The examiner relies on the following references:
Cosati et al. (Cosati) 5,244,838 Sep. 14, 1993
Tsuji et al. (Tsuji) 5,293,072 Mar. 8, 1994
Hembree 5,783,461 Jul. 21, 1998
(Filed Oct. 3, 1996)
Manteghi 5,847,455 Dec. 8, 1998
(Filed Nov. 7, 1995)
Claims 1, 3, 5, 7, 9, 11 and 13-18 stand rejected under
35 U.S.C. § 103. As evidence of obviousness, the examiner cites
Tsuji, Hembree and Manteghi with regard to claims 1, 3, 13 and
14, adding Casati with regard to claims 5, 7, 9, 11 and 15-18.
Reference is made to the briefs and answer for the
respective positions of appellants and the examiner.
OPINION
Turning our attention, first, to the independent claim, the
examiner asserts that Tsuji teaches a ball grid array package
having die pads, leads and balls which are encapsulated. Tsuji
teaches the coating of the balls, at column 5, lines 24-25, even
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