Appeal No. 2002-1919 Page 3
Application No. 09/266,376
temperature excursions of the device are reduced, which reduces thermal stress on the
device. (Id. at 27.)
A further understanding of the invention can be achieved by reading the following
claim.
1. An apparatus for minimizing thermal excursions, the apparatus
comprising:
a semiconductor device, operating at temperature equilibrium and
in a pulse mode, the pulse mode comprising an on period and an off
period, for which thermal excursions are to be minimized; and
a PCM material, thermally coupled to the semiconductor device,
whereby the PCM material absorbs heat, from the semiconductor device,
during the on period, by changing from a solid state to a liquid state and
whereby the PCM material supplies heat, to the semiconductor device,
during the off period by changing from a liquid state to a solid state.
Claims 1-10 stand rejected under 35 U.S.C. § 112. Claims 1-11 and 15 stand
rejected under 35 U.S.C. § 103(a) as obvious over U.S. Patent No. 5,007,478
(“Sengupta”).
OPINION
Our opinion addresses the following rejections:
• rejection of claims 1-10 under § 112
• rejection of claim 1-11 and 15 under § 103(a).
Rejection of Claims 1-10 under § 112
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