Interference No. 104,693
Preputnick v.Provencher
frames" and in two sentences thereafter while providing a
contrast, drops the word 'type" and states that only one lead
frame having a plurality of contacts is used to make both wafers
112 and 114. To whatever extent Preputnick might be arguing that
the same actual and physical piece of blank or lead frame is used
to make both half modules 112 and 114, the argument is rejected
for failing to provide sufficient proof.
The portion of Provencher's specification cited by
Mr. Granitz, page 8, lines 3-5, actually indicates two different
molding operations, one for wafer 112 and one for wafer 114 and
that the same material can be used to make ýeither" wafer 112 or
114, not both at once. Moreover, Provencher's Figure 4B
illustrates the lead frame immediately surrounding wafers 114 and
Figure 4C illustrates the lead frame immediately surrounding
wafers 112. The illustrated frame portions are not the same
physical components. In Provencher's brief description of the
drawings, it is stated:
FIG.4B illustrates the molding around the blank of FIG.
4A used-to form a wafer as illustrated in FIG. 3;
FIG. 4C illustrates the molding around the blank of
FIG. 4A used to form a wafer as illustrated a wafer as
illustrated in FIG. 2; (Emphasis added.)
That description is consistent with the description in
Provencher's specification that the same blank is used to make
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