The opinion in support of the decision being entered
today was not written for publication and is not
binding precedent of the Board
Paper No. 19
UNITED STATES PATENT AND TRADEMARK OFFICE
__________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
__________
Ex parte MARIO A. BOLANOS, JEREMIAS L. LIBRES,
GEORGE A. BEDNARZ, TAY LIANGCHEE,
JULIUS LIM and IRENEUS J. T. M. PAS
___________
Appeal No. 1998-2538
Application No. 08/434,336
__________
ON BRIEF
__________
Before WALTZ, KRATZ and PAWLIKOWSKI, Administrative Patent
Judges.
PAWLIKOWSKI, Administrative Patent Judge.
DECISION ON APPEAL
This is a decision on an appeal from the refusal of the
examiner to allow claims 1-5 and 7-9. We note that claim 6 has
been canceled and claims 10-24 are directed to non-elected
claims.
Claim 1 is illustrative of the subject matter on appeal:
1. A method for encapsulating integrated circuit lead frame
and die assemblies, comprising the steps of:
providing a plurality of bottom die cavity regions within a
bottom mold chase;
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