Appeal No. 1998-2538
Application 08/434,336
providing a mold compound receptacle spaced apart from said
bottom die cavity regions, for receiving a mold compound insert;
providing a plurality of runners coupling said mold compound
receptacle to each of said die cavity regions;
providing a plurality of top die cavity regions each
corresponding to a bottom die cavity region is [sic, in] said
bottom mold chase;
placing a plurality of leadframe and die assemblies on said
bottom mold chase such that each of said bottom die cavities
receives and supports an integrated circuit die coupled to a lead
frame by bond wires;
placing a mold compound insert in said mold compound
receptacle;
placing said top mold cavities over said bottom mold
cavities such that the top and bottom mold cavities are brought
into contact, the leadframe and die assemblies lying between and
within the top and bottom die cavities;
compressing said mold compound insert such that said mold
compound exits the mold compound insert and begins to move into
said runners; and
continuing to compress said mold compound insert until said
mold compound transfers into said runners and fills each of said
top and bottom mold cavities with said mold compound;
wherein said mold compound insert comprises mold compound
packaged in a sproutless packaging, comprising a thermoset resin
packaged in a sproutless plastic film that is heat sealed at the
edges, the sproutless packaging being burst open where the
runners intersect the mold compound receptacle by the pressure
caused when the mold compound insert is compressed.
The references relied upon by the examiner as evidence of
obviousness are:
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