Appeal No. 1999-0598
Application No. 08/866,064
Representative independent claim 8 is reproduced as follows:
8. A two-pole surface mount technology (SMT) miniature housing in lead
frame technique for a semiconductor component and which is mountable on
a printed circuit board having a flat surface, comprising:
a housing having a surface facing the printed circuit board all of which
is flat, all of which is parallel to, and all of which is in contact with the printed
circuit board so as to form a planar component mounting surface;
a semiconductor chip encapsulated in the housing;
a first lead frame part having the semiconductor chip mounted
thereon at a chip mounting surface thereof and a second lead frame part
contacted to the chip, both lead frame parts being conducted out of the
housing;
the first and second lead frame parts each forming solder terminals
alongside the housing, a width of the planar mounting surface being greater
than a thickness of the solder terminals;
said solder terminals being formed as punched parts and which are
finished solder terminals not requiring further length change and which run
alongside and laterally project outwardly from sidewalls of the housing at
opposite sides of the housing, said solder terminals extending vertically
downwardly to a position level with and having unbent ends terminating at
and even with the planar component mounting surface of the bottom of the
housing so that the solder terminals can be soldered to the printed circuit
board at a top surface thereof , said first and second lead frame parts with
their solder terminals having no portions which are mechanically bent and
thus have no bending stresses at any portions thereof; and
said chip mounting surface and said planar component mounting
surface formed by said housing floor being at right angles with respect to
one another.
2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 12 Next
Last modified: November 3, 2007