Appeal No. 1999-0727
Application No. 08/814,901
representative of the subject matter on appeal, reads as
follows:
1. A process for producing printed circuit boards, which
process comprises the steps of:
(a) forming circuitry, comprising circuits, pads,
lands and tabs, on a copper clad laminate;
(b) applying a registered solder mask over
substantially all of the circuitry and other
portions of the laminate in an imagewise manner;
(c) applying a single imaged desensitizing mask over
the solder mask; thereafter
(d) forming holes in an array;
(e) activating said holes to accept plating thereon;
thereafter
(f) stripping the desensitizing mask thereby
revealing the solder mask; and thereafter
(g) plating the holes.
The references of record relied upon by the examiner are:
Schneble, Jr. et al. (Schneble) 3,628,999 Dec. 21,
1971 Leech et al. (Leech) 4,551,488 Nov.
5, 1985
Bengston et al. (Bengston) 5,235,139 Aug. 10,
1993
Shigemura et al. (Shigemura) 5,348,590 Sep.
20,
1994
2
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