Appeal No. 1999-0727
Application No. 08/814,901
3, line 19 to column 4, line 52. Leech avoids these
disadvantages by using only a registered solder mask made of a
new chemical composition. See columns 3-6.
Thus, on this record, we find no evidence that the
combined teachings of Knopp, Schneble and Leech would have
suggested to one of ordinary skill in the art to employ a
registered permanent solder mask prior to applying a temporary
desensitizing mask in the print circuit board producing process
of Knopp. In the first place, to employ a registered solder
mask as the non-registered permanent solder mask described in
Schneble is to destroy the invention on which Schneble is based.
See Ex parte Hartmann, 186 USPQ 366, 367 (Bd. App. 1974). In
the second place, to the extent that there is some suggestion to
employ the new registered solder mask described in Leech, it is
taught to be used, in lieu of both
the non-registered permanent solder mask and the temporary
solder mask described in Schneble. Such a suggestion, of
course, would destroy the invention on which Knopp is based.
Id.
Since the examiner has not relied on the remaining applied
prior art references to remedy the deficiencies indicated above,
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