Appeal No. 1999-2226 Page 2
Application No. 08/582,678
BACKGROUND
The subject matter on appeal relates to a method of fabricating a pack tray for integrated
circuit chip packages. The pack tray is intended to be used for shipping integrated circuit chip
packages. The method steps include providing a master frame, providing a plurality of modules
that are separate from the master frame, and securing the plurality of modules in the master frame
to form the pack tray.
Claims 1, 7 and 21 are representative of the claims on appeal and are reproduced below1:
1. A method of fabricating a pack tray for integrated circuit chip packages comprising the
steps of:
providing a master frame;
providing a plurality of modules that are separate from said master frame; and
securing said plurality of modules in said master frame to form said pack tray.
7. The method of Claim 1 wherein said step for securing includes flowing plastic around
said plurality of modules in said master frame.
21. A method of fabricating a pack tray for integrated circuit chip packages comprising
the steps of :
1Claims 1 and 21 as set forth in the Appendix to the brief are incorrect. They have been
reproduced in this decision correctly. Specifically, in Paper No. 14, claim 1 was amended to
include the phrase “to form said pack tray” at the end, yet this phrase was not underlined. This
informal amendment should be formalized in any further prosecution of this application. (This
amendment was formally proposed in an after final amendment in the parent case, but was not
entered.) Appellant also quotes this language as being recited in the claim; see the end of the
first paragraph on page 12 of the brief. Claim 21, line 3 “with” should be --and--; this is clearly a
copying error from claim 21 presented in Paper No. 14.
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