Appeal No. 2001-1019
Application No. 08/928,826
BACKGROUND
Appellants’ invention relates to an integrated circuit package which is packaged
in a programmable manner to connect vias to conductors after mounting of the
integrated circuit die on a circuit board . An understanding of the invention can be
derived from a reading of exemplary claim 14, which is reproduced below.
14. A method for manufacturing an integrated circuit apparatus for electrically
connecting a plural number of connection pads on an integrated circuit die to external
connection pads, the method comprising the steps of:
mounting an integrated circuit die on a connector board, the
connector board including;
a central region on a first surface thereof and a plural
number of external connection pads disposed
in a selected pattern on an opposite surface of
the connector board;
a plurality of individual conductive finger connections
disposed on the first surface of the connector
board in laterally-spaced array about the
central region for forming wire connections
thereon;
a plural number of conductive vias disposed in
electrical contact with the external connection
pads and traversing the spacing between said
first and said opposite surfaces of the
connector board and being electrically
connected to selected ones of the finger
2
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