Appeal No. 2001-1019
Application No. 08/928,826
connections for providing electrical continuity between
selected finger connections and selected external
connection pads;
a first conductor on the first side of the connector
board, the first conductor not being electrically
connected to any of the conductive vias;
after the step of mounting the integrated circuit die on the
connector board, connecting a first one of the finger
connections to the first conductor, thereby electrically
connecting the first conductor with one of the conductive
vias that is connected to the first one of the finger
connections, thereby establishing whether the first conductor
will be a power conductor or a ground conductor; and
after the step of mounting the integrated circuit die on the
connector board, connecting at least two bond pads on the
integrated circuit with the first conductor.
The prior art references of record relied upon by the examiner in rejecting the
appealed claims are:
Mallik et al. (Mallik) 4,891,687 Jan. 02, 1990
Dehaine et al. (Dehaine) 4,982,311 Jan. 01, 1991
Chia et al. (Chia) 5,841,191 Nov. 24, 1998
(filed Apr. 21, 1997)
Claims 14-19 stand rejected under 35 U.S.C. § 103 as being unpatentable over
Dehaine in view of Mallik and Chia.
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