The opinion in support of the decision being entered today was not written
for publication and is not binding precedent of the Board.
Paper No. 14
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte PAUL R. BESSER, DARRELL M. ERB,
and SERGEY LOPATIN
____________
Appeal No. 2001-1090
Application No. 09/477,821
____________
ON BRIEF
____________
Before HAIRSTON, JERRY SMITH, and BLANKENSHIP, Administrative Patent Judges.
HAIRSTON, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1 through 20.
The disclosed invention relates to a method of manufacturing an electrical device in which
in-laid unalloyed copper in the upper surface of a dielectric layer is subjected to an alloying process.
Prior to the alloying process, the unalloyed copper is co-planar with the upper surface of the
dielectric layer.
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