Ex Parte BUPP et al - Page 10




          Appeal No. 2001-1305                                                        
          Application 08/872,782                                                      


          of Kametani and Voss.  We note that the Examiner relies on Bindra           
          for a teaching of one ceramic-containing dielectric layer and a             
          one outermost protective impermeable fluoropolymer layer devoid             
          of ceramic material deposed on and covering said at least one               
          ceramic containing dielectric layer.  See page 5 of the                     
          Examiner’s answer.  We further note that claim 5 recites                    
                    wherein said outermost and opposing outermost                     
               impermeable fluoropolymer barrier layers are devoid of                 
               ceramic components, and said first and second intermediate             
               dielectric-layers comprise ceramic containing                          
               fluoropolymers, and                                                    
                    wherein said outermost and opposing outermost                     
               impermeable fluoropolymer barrier layers are impermeable to            
               process chemicals encountered during fabrication of said               
               packaging platform and permit metallized ceramic line                  
               processes without degradation of said packaging platform.              
          Similarly, Appellants claim 10 recites                                      
                    a laminate having opposite outer surfaces and including           
               at least one ceramic containing dielectric layer disposed              
               and covering one of said opposite outer surfaces, said                 
               surface further comprising fine line circuitry and at least            
               one outer most impermeable protective fluoropolymer barrier            
               layer devoid of ceramic material wherein said outer most               
               impermeable barrier layer covers said at least one ceramic-            
               containing dielectric layer and is impermeable to process              
               chemicals encountered during fabrication of said circuitized           
               structure and permits metallized ceramic line processes                
               without degradation of said circuitized structure.                     
          Therefore, for the same reasons as we discussed above, we find              
          that Bindra fails to teach these limitations.                               


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