Appeal No. 2001-1421
Application No. 09/128,226
The claimed invention relates to an underfilling method for
a flip-chip packaging process in which an underfill material
layer is initially formed over bumps on a semiconductor
substrate. A die sawing process is then performed to form a
plurality of dies followed by a flip-chip process on each the
dies to adhere the dies to another substrate. According to
Appellants (specification, page 3), because the underfill
material is coated from the top of the bumps before the flip–chip
process, the problem of air being trapped between the die and the
adhered substrate can be eliminated. In addition, Appellants
assert that process time is shortened since underfill material is
dispensed over all of the dies before die sawing in contrast to
the conventional underfilling process in which underfill material
needs to be dispensed and the edges sealed on each individual
die.
Claim 1 is illustrative of the invention and reads as
follows:
1. An underfilling method for a flip-chip packaging
process, the method comprising:
providing a first semiconductor substrate, wherein the first
semiconductor substrate has at least a plurality of pads and a
passivation layer, wherein the passivation layer is formed over
the substrate but exposes the pads, and wherein the passivation
layer is thicker than the pads;
-2–2
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 Next
Last modified: November 3, 2007