Appeal No. 2001-1509
Application No. 08/871,890
wherein solder pads other than the solder pads
connected to the conductor pattern on the outermost surface
form the inner layer pad group; and
wherein the inner layer pad group comprises solder pads
which are connected to viaholes connected to flat inner
layer pads located on one of a first inner layer and at
least one further inner layer with solder bumps being formed
in recess portions of the viaholes, the inner layer pad
group comprising solder pads located in at least one and up
to five rows from an outer position of the inner layer pad
group that are connected through the viaholes to flat pads
connected to conductor patterns on the first inner layer,
while solder pads of the inner layer pad group other than
the solder pads connected to flat pads connected to
conductor patterns on the first inner layer are connected
through the viaholes to flat pads located on the at least
one further inner layer located inward relative to the first
inner layer.
The Examiner relies on the following prior art:
Kumagai et al. (Kumagai) 5,248,852 Sep. 28, 1993
Bhatt et al. (Bhatt) 5,487,218 Jan. 30, 1996
Kato et al. (Kato) JP402100353A Apr. 12, 1990
Sygiyama et al. (Sygiyama)1 JP 7-106767 Apr. 21, 1995
(Published Japanese Kokai Patent Application)
Asai et al. (Asai) WO 96-39796 Dec. 12, 1996
(Published Japanese Patent Application)
Claims 5-24 stand finally rejected under 35 U.S.C. § 103(a).
As evidence of obviousness, the Examiner offers Sygiyama
(hereinafter JP ‘767) in view of Bhatt with respect to claims 5,
9, 13, and 17, adds Kumagai and Kato to the basic combination
1 Copies of translations of the Sygiyama and Asai references provided by
the U.S. Patent and Trademark Office on May 2000 and October 2002,
respectively, are enclosed with this decision.
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