Appeal No. 2001-1556
Application 09/333,322
The disclosed invention pertains to a carrier element
which in combination with a semiconductor chip is to be
incorporated into a smart card.
Representative claim 1 is reproduced as follows:
1. In combination with a semiconductor chip, a carrier
element, comprising:
an encapsulation composition having main surfaces and
opposite edges and encapsulating and protecting the semiconductor
chip;
at least two connections disposed on one of said main
surfaces of said encapsulation composition along only two of said
opposite edges, said at least two connections made of a
conductive material and having embossed ends facing one another
with a reduced thickness at said embossed ends and with a cross
section having a step only on one side of said at least two
connections; and
the semiconductor chip disposed on said at least two
connections in a region of said reduced thickness and being
mechanically connected to said at least two connections resulting
in mechanical connections.
The examiner relies on the following references:
Haghiri-Tehrani et al. 4,829,666 May 16, 1989
(Haghiri-Tehrani)
LeMaire et al. (LeMaire) 5,134,773 Aug. 04, 1992
Claims 1-13 stand rejected under 35 U.S.C. § 103. As
evidence of obviousness the examiner offers LeMaire in view of
Haghiri-Tehrani.
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