Ex Parte SANDHU et al - Page 7



          Appeal No. 2002-0514                                                        
          Application No. 08/886,388                                 Page 7           

          minimum feature dimension could be determined and that                      
          representative claim 44 does not specify a particular photo-                
          lithography method for fabricating the product but rather is open           
          to a plethora of photolithographic methods, each of which could             
          have a different characteristic photolithographic minimum feature           
          dimension associated therewith.  Hence, the specification                   
          provides little help in determining the metes and bounds of the             
          claimed subject matter.                                                     
               In addition, a process other than a photolithography process           
          could be used to manufacture stacked capacitors by a potential              
          infringer.  In such a case, there would be no photolithographic             
          process from which to derive a “minimum photolithographic feature           
          dimension” of the potential infringer’s product.  Consequently, a           
          potential infringer may have no way of determining whether the              
          plate spacing and plug diameter of their device are less than               
          that required by appellants’ claims.                                        
               Appellants refer us to several other patents in an attempt             
          at establishing that the claim terms in question are definite.              
          We do not find that argument persuasive for reasons set forth by            
          the examiner at pages 17-19 of the answer.  The claims of this              
          application are construed in light of the present application               
          specification not the specifications of other patents.                      





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