Appeal No. 2002-0643
Application No. 09/100,538
The subject matter on appeal relates to a heater chip
module (claims 1 and 3-5), a flexible circuit/heater chip module
assembly (claims 12, 14-16, and 23-25), and an ink jet print
cartridge (claims 26-28). According to the appellants (appeal
brief filed Jul. 27, 2001, paper 29, page 2), the claimed heater
chip module is mounted in a cavity of a single layer metal
(i.e., steel, aluminum, copper, zinc, nickel, and alloys
thereof) substrate, which provides a dissipation path for heat
generated by the heater chip. Further details of this appealed
subject matter are recited in representative claim 1 reproduced
below:
1. A heater chip module comprising:
a rigid carrier secured to a container for
receiving ink and including a substantially rigid,
single layer metal support section, said metal being
selected from the group consisting of steel, aluminum,
copper, zinc, nickel and alloys thereof;
a heater chip within an inner cavity formed
within said metal support section and coupled to said
metal support section at the bottom of said cavity,
said metal support section including at least one
passage which defines a path for ink to travel from
the container to said inner cavity of said heater
chip; and
a nozzle plate coupled to said heater chip,
wherein said carrier provides a dissipation path for
heat generated by said heater chip.
2
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