Appeal No. 2002-0643
Application No. 09/100,538
IV. claim 25 as unpatentable over Braun, Oda, Fukuda, and
Hanson (id.).
We affirm these rejections.2
Braun describes a print/cartridge construction including a
fluid block 50 (i.e., a rigid carrier) that is secured to a
container for receiving ink, a drop ejection chip 60 having
resistive heater elements 64 disposed within a recess of the
fluid block 50 (i.e., a heater chip within an inner cavity of
the fluid block 50), and an orifice plate 80 (i.e., nozzle
plate). (Figures 1 and 3A-3E; column 1, line 59 to column 2,
line 18; column 3, line 58 to column 4, line 29.) Braun further
suggests that a heat sink element may be disposed between the
chip and the fluid block component to control the chip substrate
temperature. (Column 4, lines 35-41.)
Thus, Braun differs from the subject matter of appealed
claim 1 in that it does not disclose the use of a metal such as
steel, aluminum, copper, zinc, nickel, or alloys thereof as the
material for constructing the heat sink element.
2 The appellants state that “[a]ll of the pending claims
are deemed for purposes of this appeal to stand and [sic, or]
fall with claim 1” and, in fact, rely on the same arguments for
all four grounds of rejection. (Appeal brief, pp. 4-5.) Under
these circumstances, we confine our discussion to the invention
recited in appealed claim 1. 37 CFR §§ 1.192(a), c(7) and c(8)
(1995, 1997).
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