Appeal No. 2003-0196
Application No. 08/601,258
insulating base, and controlling the temperature and duration at
which the platinum film is heat-treated after formation of the film
so as to adjust the TCR of the platinum film to the desired TCR of
3850 ppm/K (Answer, page 3).
The examiner recognizes that Wienand teaches that the platinum
film may be deposited by physical evaporation or sputtering and
thus differs from the claimed method by not requiring that the
platinum film be deposited by applying and sintering a platinum
metal compound (id.). Accordingly, the examiner applies Uriu for
the teaching of a method of making a temperature-measuring
resistive element having an electrically insulating base and a
platinum film formed on the base with a specified TCR, where the
platinum film is formed by sintering a metalloorganic platinum
paste located on the base (Answer, page 4). From these findings,
the examiner concludes that it would have been obvious to one of
ordinary skill in the art at the time the invention was made to
have applied the platinum film of Wienand by applying and sintering
an organic platinum compound instead of evaporating or sputtering
with the expectation of similar results (id.). We agree.
Appellants agree with the factual findings set forth by the
examiner but argue that there is no suggestion or desirability
shown in the references to support the proposed combination of
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