Ex Parte Beckage - Page 7




              Appeal No. 2003-0242                                                               Page 7                
              Application No. 09/484,604                                                                               


                     On page 9 of the answer, the examiner asserts that Sandhu teaches a means of                      
              measuring the surface friction "equivalent" to that of Birang, thus implying that it would               
              have been obvious at the time the invention was made to a person of ordinary skill in                    
              the art to have substituted Sandhu's means of measuring the surface friction for                         
              Birang's means of measuring the surface friction.  We do not agree that Sandhu                           
              teaches a means of measuring the surface friction "equivalent" to that of Birang.  In that               
              regard, Sandhu teaches a means of measuring the surface friction which relies on a                       
              change in the coefficient of friction between the wafer 10, polishing slurry 18, and                     
              polishing platen 16 to change the load or amperage draw of the drive motors 26, 28.                      
              Specifically, as the oxide coating of a wafer 10, as shown in Figure 1 of Sandhu, is                     
              removed to the plane of the tops of the IC devices the coefficient of friction will change               
              and that change is detected by a different amperage draw of the current meters 22, 24.                   
              Since no such "equivalent" change occurs in the conditioning process of Birang (i.e.,                    
              neither the conditioning head 12 nor the polishing pad 14 undergoes an abrupt change                     
              in the coefficient of friction as when the oxide coating of a wafer 10 is removed to the                 
              plane of the tops of IC devices as in Sandhu), there is no suggestion, incentive or                      
              motivation in the applied prior art to combine the teachings thereof to arrive at the                    
              claimed invention.  The mere fact that the prior art could be modified in the manner                     
              suggested by the examiner does not make such a modification obvious unless the prior                     









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