Appeal No. 2003-0456 Page 2
Application No. 09/149,289
After a photoelectric conversion device is fabricated, output leads must be
provided. Conventionally, such leads are connected to electrodes of the device by
soldering. Because a substrate made of the aforementioned material suffers from a
"poor thermal resistance," (id.), however, the appellants explain that heat applied during
the soldering deforms the substrate. (Id. at 2-3.)
In contrast, the appellants use an epoxy resin to bond output leads to their
device "independent of electrical connection of the leads with electrodes of the device."
(Id. at 6.) Consequently, they assert, "a sufficient bonding strength is accomplished
without applying high temperature locally." (Id. at 6.)
A further understanding of the invention can be achieved by reading the following
claim.
9. A method of manufacturing a photoelectric conversion device
comprising:
preparing a substrate having a front surface and a rear surface
wherein said substrate comprises an organic material;
forming a first electrode on said front surface of the substrate;
forming a semiconductor layer on said first electrode;
forming a second electrode on said semiconductor layer;
forming at least one hole through said substrate and through said
semiconductor layer;
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Last modified: November 3, 2007