Ex Parte SHIH et al - Page 5



          Appeal No. 2003-0626                                                        
          Application No. 09/410,896                                                  
          rejection.                                                                  
               Rejection of claims 16, 18 and 20 under 35 U.S.C. § 102(e)             
               Anticipation requires the disclosure, in a single prior art            
          reference, of each element of the claim under consideration.                
          See W. L. Gore & Assocs. v. Garlock, Inc., 721 F.2d 1540, 1554,             
          220 USPQ 303, 313 (Fed. Cir. 1983).  According to the examiner,             
          Flanigan discloses a structure which reads on appellants’ claims            
          16, 18 and 20.  The examiner found that in Fig. 2, Flanigan shows           
          a pedestal assembly having a top surface including five                     
          concentrically formed circular grooves and at least five radially           
          formed linear grooves each of which is in communication with the            
          circular grooves.  Examiner’s answer, page 5.  A gas conduit                
          extends from the bottom of the pedestal assembly through an                 
          opening in the top surface “to allow a heat transfer gas to be              
          pumped under the wafer during processing.”  Flanigan, column 4,             
          lines 66 - column 5, line 10.                                               
               According to appellants, the grooves shown in the top                  
          surface 103 of Flanigan’s electrostatic chuck 105 are “not used             
          for cooling at all, instead, the grooves are used for achieving             
          heat transfer on the wafer backside thus achieving a more uniform           
          wafer temperature. . . .  The surface grooves provided by                   
          Flanigan et al are therefore not used to ‘enable cooling using a            

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