Ex Parte Cheung et al - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication in a law journal                 
               and is not binding precedent of the Board.                             
                                                               Paper No. 27           


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                                                                     
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                                                                     
                         Ex parte ROBIN CHEUNG, YEZDI DORDI                           
                                 and JENNIFER TSENG                                   
                                                                                     
                                Appeal No. 2003-0636                                  
                             Application No. 09/599,125                               
                                                                                     
                                      ON BRIEF                                        
                                                                                     
          Before KIMLIN, WALTZ and DELMENDO, Administrative Patent Judges.            
          KIMLIN, Administrative Patent Judge.                                        


                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 1-8,              
          10-19 and 25-31.  Claim 1 is illustrative:                                  
          1.   A method for processing a substrate surface, comprising:               
               planarizing a substrate surface comprising a conductive                
          material; and                                                               
               forming a metal-containing layer on the substrate surface              
          during substrate cleaning with a cleaning composition comprising            
          an electroless plating solution.                                            


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