Appeal No. 2003-1233
Application No. 09/420,817
need for packages which comprise multiple chips that have been connected together prior
to connection to the outside world. Claim 24, which is representative of the claimed
invention, appears below:
24. A multi-chip module comprising:
a central support layer having a central aperture, a top side and a bottom
side, a bonding pad on each of said sides and conductive interconnections
extending through said layer;
a first chip wire bonded to the top side of said layer through said aperture
and secured to the bottom side of said layer;
a second chip secured to the top side of said layer, said second ship secured
by bumps to said layer; and
said layer extending outwardly beyond said first and second chips, said
layer including a solder ball pad on an extension extending outwardly
beyond said first and second chips for electrically connecting said chips to
external devices.
Appellant has indicated that “all of the pending claims may be grouped with
claim 24.” (Brief, p. 5). We interpret Appellant’s statement as indicating that all of the
claims stand or fall together. Accordingly, all the claims will stand or fall together, and
we select claim 24 as representative of the rejected claims. Note In re King, 801 F.2d
1324, 1325, 231 USPQ 136, 137 (Fed. Cir. 1986); In re Sernaker, 702 F.2d 989, 991,
217 USPQ 1, 3 (Fed. Cir. 1983). 37 CFR § 1.192 (c)(7) and (8) (2001).
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