Appeal No. 2003-1233
Application No. 09/420,817
resin encapsulation was known by persons of ordinary skill in the art. (Col. 1, ll. 10-20).
Bertin discloses wire bonding of a semiconductor package through a central hole to
connect a chip to the central layer. (Figure 8). Thus, a person of ordinary skill in the art
would have known the proper techniques for the use of wire bonding through a central
aperture.
Based on our consideration of the totality of the record before us, having evaluated
the prima facie case of obviousness in view of Appellant’s arguments, we conclude that
the subject matter of claims 21 to 29 and 39 to 47 would have been obvious to a person of
ordinary skill in the art from the combined teachings of the cited prior art for the reasons
stated above and in the Answer.2
CONCLUSION
The rejection of claims 21 to 29 and 39 to 47 under 35 U.S.C. § 103(a) as obvious
over the combination of Egawa, Bertin and Hamzehdoost is affirmed.
2 Since Appellant indicated that issues of patentability should be determined based upon claim
24, we have not provided a discussion of the Hamzehdoost reference. The Examiner applied the
teachings of this reference for elements of other claims.
6
Page: Previous 1 2 3 4 5 6 7 8 Next
Last modified: November 3, 2007