Appeal No. 2003-2014
Application No. 09/757,185
The subject matter on appeal relates to a method for bonding
which comprises bonding a heat sink to an overmold surface with
silicon-containing residue thereon by applying a porous polymer
film impregnated with epoxy adhesive between the heat sink and
the surface of the overmold. Further details of this appealed
subject matter is set forth in representative independent claim
11 which reads as follows:
1. A method for bonding comprising the steps of:
providing a molded polymer molded to a substrate,
wherein the molded polymer comprises an overmold, and
wherein the overmold has a surface with silicon-
containing residue thereon;
bonding an article to the surface of the overmold
by applying a porous polymer film between the article
and the surface of the overmold, wherein the film is
impregnated with epoxy adhesive, and wherein the
article comprises a heat sink; and
heat curing the impregnated film so that a bond
strength between the heat sink and the surface of the
overmold is greater than a bond strength between the
overmold and the substrate.
The prior art set forth below is relied upon by the examiner
as evidence of obviousness:
Korleski, Jr. (Korleski) 5,879,794 Mar. 09, 1999
Appellants’ Admitted Prior Art, specification, pages
1-3; page 6, lines 18-24; and page 13, lines 14-17.
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