Appeal No. 2003-2105 Page 3
Application No. 08/755,928
A further understanding of the invention can be achieved by reading the following
claim.
32. A semiconductor device comprising:
an external potential contact means supplied with an external
power-source potential different from a ground level;
a first pad connected to said external potential contact means with
a first connecting member;
a second pad provided separately from said first pad, and
connected to said external potential contact means with a second
connecting member different from the first connecting member;
a first circuit for receiving said external power-source potential from
said first pad as a first drive power-source potential; and
a second circuit for receiving an output signal of said first circuit,
said second circuit being coupled to said second pad and receiving said
external power-source potential as a second drive power-source potential
distinct from said external power source potential used as said first drive
power-source potential.
Claims 32 and 33 stand rejected under 35 U.S.C. § 103(a) as obvious over U.S.
Patent No. 5,194,762 ("Hara") and U.S. Patent No. 5,559,356 ("Yukawa").
OPINION
Rather than reiterate the positions of the examiner or the appellant in toto, we
focus on the main point of contention therebetween. Admitting that "Hara et al. does not
expressly disclose in the description . . . the use of 'a first connecting member' and 'a
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