Appeal No. 2003-2145
Application No. 09/310,627
BACKGROUND
Appellant’s invention is directed to a printed circuit board assembly. According
to Appellant, the invention has improved thermal conductivity through the use of
thermally conductive plug placed within the vias. (Specification, p. 3). Claims 43, 47
and 53 which are representative of the invention are reproduced below:
43. A printed circuit board assembly, comprising:
a metal plated first via extending through the printed circuit board;
a thermally conductive plug extending into said first via, said plug
including a plurality of grooves on an exterior surface thereof;
solder disposed between said grooves and the walls of said first via;
a separable heat sink component adapted for connection to the printed
circuit board; and
a separate layer of copper foil for disposition between the heat sink
component and the printed circuit board, to provide thermal
communication between said heat sink component and said plug.
47. A printed circuit board assembly, comprising:
a metal plated first via extending through the printed circuit board;
a thermally conductive plug extending into said first via, said plug having
an internal channel extending therethrough for conducting solder from one
side of the printed circuit board to the other; and
a separable heat sink component adapted for connection to the printed
circuit board so as to be in thermal communication with said plug.
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