Appeal No. 2003-2145
Application No. 09/310,627
53. A printed circuit board assembly, comprising:
a metal plated first via extending through the printed circuit board;
a thermally conductive plug extending into said via;
an electronic component having a body portion and a lead portion;
solder disposed between said body portion of said electronic component
and said plug and between said body portion of said electronic component
and a side of the printed circuit board;
a separable heat sink component; and
a layer of copper foil for disposition between the heat sink component and
the printed circuit board.
CITED PRIOR ART
As evidence of unpatentability, the Examiner relies on the following prior art:
August et al. (August) 4,628,407 Dec. 09, 1986
Alexander et al. (Alexander) 5,189,261 Feb. 23, 1993
Kubo et al. (Kubo) 5,656,798 Aug. 12, 1997
Hunninghaus et al. (Hunninghaus) 5,708,566 Jan. 13, 1998
-3-
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