Appeal No. 2003-2174
Application No. 09/915,071
BACKGROUND
The invention relates to a semiconductor die comprising a pair of opposed parallel
major surfaces and a periphery. The semiconductor die comprises an active circuit area
within the boundary on one of the major surfaces. The active circuit area comprises at least
one active circuit element that dissipates heat during operation. The semiconductor die
comprises a heat spreading extension disposed between at least a portion of the boundary
and at least a portion of the die periphery adjacent the boundary portion. The extension
operates to establish a heat flow path to conduct heat away from the heat dissipating active
circuit element. Claims 1 and 8, which are representative of the claimed invention, appear
below:
1. A semiconductor die comprising:
a pair of opposed parallel major surfaces and a periphery;
an active circuit area within a boundary on at least one of the major surfaces of
the semiconductor die, said active circuit area comprising at least one active
circuit element that dissipates heat during operation; and
a heat spreading extension disposed between at least a portion of said
boundary and at least a portion of said die periphery adjacent said boundary
portion, said extension being operable to establish a heat flow path to conduct
heat away from said at least one heat dissipating active circuit element.
8. A semiconductor package comprising:
a package substrate having an upper surface;
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