Appeal No. 2003-2174
Application No. 09/915,071
a thermally conductive cover secured to said package substrate, said cover
including an inner surface, said inner surface of said cover and said upper
surface of said package substrate defining a space; and
a semiconductor die enclosed within said space, said semiconductor die having
a major surface and a periphery, said surface of said semiconductor die
including an active circuit area comprising at least one active circuit element
dissipating heat during operation of the semiconductor package, said active
circuit area having a boundary, said surface of said semiconductor die being
thermally coupled to said inner surface of said cover and wherein the die
includes a heat spreading extension integral with the die, said heat spreading
extension being disposed between said boundary of said active circuit area and
said periphery of said die, said heat spreading extension being operable to
establish a heat flow path to conduct heat away from said at least one active
circuit element.
CITED PRIOR ART
As evidence of unpatentability, the Examiner relies on the following references:
Torres et al. (Torres) 5,962,926 Oct. 05, 1999
The Examiner also relied on the admitted prior art of Figure 1.
The Examiner has rejected claims 1 to 7 as anticipated under 35 U.S.C. § 102(b) over
Torres; and claims 8 to 13 as obvious under 35 U.S.C. § 103(a) over the combination of
Torres and the admitted prior art of Figure 1. (Answer, pp. 3 to 13).
Appellant has indicated, Brief page 4, that claims 1, 2 and 3 stand or fall together,
claim 4 stands or falls alone, claims 5 to 7 stand or fall together and claims 8 to 13 stand or
fall together. We will consider the claims separately only to the extent that separate
-3-
Page: Previous 1 2 3 4 5 6 7 8 9 Next
Last modified: November 3, 2007