Appeal No. 2004-0133
Application No. 09/668,031
ordinary skill in the art to apply the disclosure associated with
Lee’s Figure 12 to a wafer as well as a single die. Since a
wafer is diced to produce singular dies, one of ordinary skill in
the art would have been faced with the option of providing the
heat sink to the back surface of the die either individually,
after dicing the wafer, or to the entire wafer before dicing. In
our view, one of ordinary skill in the art would have found it
obvious and expedient to provide the heat sink and intermediate
layers to the back surface of the wafer before it is diced into
individual dies rather than processing each single die
individually.
Regarding the method of claim 11 which comprises depositing
the barrier and metallic layers on the back surface of the wafer
before dicing to provide individual die, and soldering a metallic
heat sink to the back surface of selected die, we find, as
explained above, that it would have been obvious for one of
ordinary skill in the art to provide the chrome alloy layer 72A,
gold 84 and heat sink 80 to the back surface of the wafer before
dicing as well as to individual die after dicing. However, as
also explained above, with respect to the examiner’s § 102
rejection of method claim 12, Lee does not describe the steps of
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