Ex Parte Gillett et al - Page 1




          The opinion in support of the decision being entered today was              
          not written for publication and is not binding precedent of the             
          Board.                                                                      
                                                            Paper No. 21              

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                     __________                                       
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                     __________                                       
                    Ex parte BLAKE A. GILLETT, SEAN T. CROWLEY,                       
                      BRADLEY D. BOLAND and  KEITH M. EDWARDS                         
                                     __________                                       
                                Appeal No. 2004-0763                                  
                               Application 09/827,791                                 
                                     ___________                                      
                                      ON BRIEF                                        
                                     ___________                                      
          Before GARRIS, WARREN and OWENS, Administrative Patent Judges.              
          OWENS, Administrative Patent Judge.                                         

                                 DECISION ON APPEAL                                   
               This appeal is from the refusal to allow claims 1-9 and 21-            
          31 as amended after final rejection.  These are all of the claims           
          pending in the application.                                                 
                                    THE INVENTION                                     
               The appellants claim a leadframe for a two-lead, surface-              
          mounting, high power semiconductor package, and claim a                     




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