Appeal No. 2004-0463
Application 09/827,791
semiconductor package which includes the leadframe. Claim 1,
directed toward the leadframe, is illustrative:
1. A leadframe for a two-lead, surface-mounting, high
power semiconductor package, the leadframe comprising:
a microstructure having parallel and respectively co-planar
upper and lower surfaces, including:
an I-shaped die pad having a head, a foot, and opposite
first and second sides;
an elongate, straight first lead disposed at the foot of the
die pad, the first lead having a side aligned with the first side
of the pad, a proximal end proximate to the die pad, and an
opposite, distal end; and
an L-shaped second lead disposed at the foot of the die pad,
the second lead having a side aligned with the second side of the
die pad, a proximal end, an opposite, distal end, and a wire
bonding arm extending along the die pad in spaced relation
thereto, the wire bonding arm defining the proximal end of the
second lead which is disposed proximate to the first lead.
THE REFERENCES
Magni 6,281,566 Aug. 28, 2001
(filed Sep. 25, 1997)
Huang 6,384,472 May 7, 2002
(filed Mar. 24, 2000)
THE REJECTIONS
The claims stand rejected under 35 U.S.C. § 103 as follows:
claims 1-3, 5, 6, 8 and 9 over the appellants’ prior art
figures 1-3 (APAF 1-3) in view of Magni; claims 4 and 7 over
APAF 1-3 in view of Magni and Huang; claims 21, 23, 25, 26
2
Page: Previous 1 2 3 4 5 6 Next
Last modified: November 3, 2007