Appeal No. 2003-
Application No. 09/
23. An electronic substrate comprising:
a substrate formed of a substantially insulating
material,
at least one surface groove in said substrate
filled with a conductive metal, and
at least one aperture in said substrate filled
with said conductive metal providing electrical
communication to said at least one surface groove.
The examiner relies on the following prior art reference as
evidence of unpatentability:
Kitamura et al. 5,480,048 Jan. 2, 1996
(Kitamura)
Claims 23 through 26 on appeal stand rejected under 35
U.S.C. § 102(b) as anticipated by Kitamura. (Examiner’s answer
mailed Sep. 23, 2003, paper 12, pages 3-4.)
We affirm.1
Kitamura describes an insulation film 107 (corresponding to
the appellants’ recited “substrate formed of a substantially
insulating material”), which is part of a multilayer wiring
board. (Column 6, line 59 to column 7, line 43; Figures 1a-1h.)
Kitamura further teaches a horizontal wiring conductor 101,
which defines a filled surface groove on the insulation film
107, and a vertical via conductor 102, which defines a filled
1 The appellants state: “The rejection of claims 23-26 are
contested as a group.” (Appeal brief filed Aug. 26, 2003, paper
11, p. 4.) Accordingly, we select claim 23 from the group of
rejected claims and decide this appeal as to the examiner’s
ground of rejection on the basis of this claim alone. See 37
CFR § 1.192(c)(7) (1995)(effective Apr. 21, 1995).
2
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