Appeal No. 2003- Application No. 09/ and is filled with a conductive metal such as that taught by the present invention. The appellants then urge that “Kitamura [] does not teach at least one surface groove in a substrate” and that “[t]he base substrate 100 of Kitamura [] is clearly shown with a smooth top surface.” (Id. at page 6.) The appellants’ position lacks merit. While Kitamura does not state that insulation film 107 is a “substrate,” we note that the present specification places no limitation on the type of substantially insulating material that may be used to form the “substrate.” Nor does the present specification limit the structure of the “substrate” in any way. Absent any special definition in the specification,2 we construe the term “substrate” to encompass or read on Kitamura’s insulation film 107.3 2 See, e.g., In re Morris, 127 F.3d 1048, 1054, 44 USPQ2d 1023, 1027 (Fed. Cir. 1997). 3 The appellants contend that Kitamura’s insulation film 107 “is not a substrate[] and cannot be interpreted as such in the common sense of semiconductor structures.” (Appeal brief, p. 8.) The appellants, however, fail to point to any evidence in the record to substantiate this unsupported allegation. It has long been held that mere lawyer’s arguments and conclusory statements, which are unsupported by factual evidence, are entitled to little probative value. In re Geisler, 116 F.3d 1465, 1470, 43 USPQ2d 1362, 1365 (Fed. Cir. 1997); In re De Blauwe, 736 F.2d 699, 705, 222 USPQ 191, 196 (Fed. Cir. 1984); In re Wood, 582 F.2d 638, 642, 199 USPQ 137, 140 (CCPA 1978); In re Lindner, 457 F.2d 506, 508-09, 173 USPQ 356, 358 (CCPA 1972). 4Page: Previous 1 2 3 4 5 6 NextLast modified: November 3, 2007