Appeal No. 2004-0710 Application No. 09/726,260 a plurality of first electrically conducting leads, wherein a part of each of said first electrically conducting leads extend under said second surface of said single integrated circuit element; a plurality of second electrically conducting leads, wherein no part of said second electrically conducting leads extend under said second surface of said single integrated circuit element; bonding material between said second surface of said single integrated circuit element and said parts of said first electrically conducting leads extending under said second surface of said single integrated circuit element, wherein said bonding material is a thermal conductor, an electrical non-conductor, and attaches said second surface of said single integrated circuit element to said parts of said first electri- cally conducting leads extending under said second surface of said single integrated circuit element; and electrical connections formed between said input/output pads on said first surface of said single integrated circuit element and said first electrically conducting leads and between said input/output pads on said first surface of said single integrated circuit element and said second electrically conducting leads. In addition to the admitted prior art found in appellants’ specification, the examiner relies upon the following reference: Ball 5,689,135 Nov. 18, 1997 Appellants’ claimed invention is directed to an electronic circuit package comprising a single integrated circuit element (28) and a plurality of first and second electrically conducting 2Page: Previous 1 2 3 4 5 6 7 8 NextLast modified: November 3, 2007