Ex Parte Zhang et al - Page 2




          Appeal No. 2004-0710                                                        
          Application No. 09/726,260                                                  


                    a plurality of first electrically conducting                      
               leads, wherein a part of each of said first                            
               electrically conducting leads extend under said second                 
               surface of said single integrated circuit element;                     
                    a plurality of second electrically conducting                     
               leads, wherein no part of said second electrically                     
               conducting leads extend under said second surface of                   
               said single integrated circuit element;                                
                    bonding material between said second surface of                   
               said single integrated circuit element and said parts                  
               of said first electrically conducting leads extending                  
               under said second surface of said single integrated                    
               circuit element, wherein said bonding material is a                    
               thermal conductor, an electrical non-conductor, and                    
               attaches said second surface of said single integrated                 
               circuit element to said parts of said first electri-                   
               cally conducting leads extending under said second                     
               surface of said single integrated circuit element; and                 
                    electrical connections formed between said                        
               input/output pads on said first surface of said single                 
               integrated circuit element and said first electrically                 
               conducting leads and between said input/output pads on                 
               said first surface of said single integrated circuit                   
               element and said second electrically conducting leads.                 
               In addition to the admitted prior art found in appellants’             
          specification, the examiner relies upon the following reference:            
                    Ball           5,689,135      Nov. 18, 1997                       
               Appellants’ claimed invention is directed to an electronic             
          circuit package comprising a single integrated circuit element              
          (28) and a plurality of first and second electrically conducting            




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