Appeal No. 2004-0710 Application No. 09/726,260 leads. A part of the first electrically conducting leads extends under the integrated circuit element, whereas no part of the plurality of second electrically conducting leads extends under the integrated circuit element. A thermally conductive electrically non-conductive bonding material is used to bond the parts of the first electrically conducting leads which extend under the integrated circuit element to the element. According to appellants, “[t]he extended leads bonded to the back side of the chip provide a thermal conduction path to remove heat energy from the chip” (page 5, of brief, first paragraph). Appealed claims 11-20 stand rejected under 35 U.S.C. § 103 as being unpatentable over Ball in view of the admitted prior art. Appellants submit at page 8 of the brief that “[c]laims 11-20 . . . will be argued as a group and stand or fall together.” Accordingly, all the claims stand or fall together with claim 11. We have thoroughly reviewed each of appellants’ arguments for patentability. However, we are in complete agreement with the examiner that the claimed subject matter would have been 3Page: Previous 1 2 3 4 5 6 7 8 NextLast modified: November 3, 2007