Ex Parte Zhang et al - Page 3




          Appeal No. 2004-0710                                                        
          Application No. 09/726,260                                                  


          leads.  A part of the first electrically conducting leads extends           
          under the integrated circuit element, whereas no part of the                
          plurality of second electrically conducting leads extends under             
          the integrated circuit element.  A thermally conductive                     
          electrically non-conductive bonding material is used to bond the            
          parts of the first electrically conducting leads which extend               
          under the integrated circuit element to the element.  According             
          to appellants, “[t]he extended leads bonded to the back side of             
          the chip provide a thermal conduction path to remove heat energy            
          from the chip” (page 5, of brief, first paragraph).                         
               Appealed claims 11-20 stand rejected under 35 U.S.C. § 103             
          as being unpatentable over Ball in view of the admitted prior               
          art.                                                                        
               Appellants submit at page 8 of the brief that “[c]laims                
          11-20 . . . will be argued as a group and stand or fall                     
          together.”  Accordingly, all the claims stand or fall together              
          with claim 11.                                                              
               We have thoroughly reviewed each of appellants’ arguments              
          for patentability.  However, we are in complete agreement with              
          the examiner that the claimed subject matter would have been                




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