Appeal No. 2004-0760
Application No. 10/010,392
THE INVENTION
The invention relates “generally to semiconductor structure,
and more particularly, to structure for suppressing semiconductor
chip curvature and reducing chip temperature while improving
device speed and reliability” (specification, page 1).
Representative claim 5 reads as follows:
5. A semiconductor structure comprising:
a substrate;
a semiconductor device secured to the substrate; and
a stabilizing member secured to the semiconductor
device;
the bending stiffness of the substrate being generally
similar to the bending stiffness of the stabilizing member,
wherein;
bending stiffness = Et3, with E = Young’s modulus, and
t = thickness;
wherein Young’s modulus of the stabilizing member is
greater than Young’s modulus of the substrate.
THE REJECTION
Claims 5 through 10, 12 through 14 and 30 stand rejected
under 35 U.S.C. § 102(b) as being anticipated by U.S. Patent No.
5,811,317 to Maheshwari et al. (Maheshwari).
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