Appeal No. 2004-1252
Application No. 09/705,710
30. An apparatus for inserting conductive leads into a
semiconductor die package housing, the housing having a plurality
of side walls defining an exterior surface of said housing, each
of the side walls having a plurality of lead passages formed
therethrough, the apparatus comprising:
a lead pusher for inserting conductive leads into lead
passages on a side of the housing, said lead pusher including a
groove for holding a conductive lead during insertion.
THE PRIOR ART
The references relied on by the examiner to support the
final rejection are:
Ragard et al. (Ragard) 3,783,488 Jan. 8, 1974
Kirsch et al. (Kirsch) 4,187,051 Feb. 5, 1980
Tamano et al. (Tamano) 4,672,735 Jun. 16, 1987
Holcomb 4,862,578 Sep. 5, 1989
THE REJECTIONS
Claims 30 through 42, 44, 47, 48 and 51 through 55 stand
rejected under 35 U.S.C. § 102(b) as being anticipated by Ragard,
and in the alternative under 35 U.S.C. § 103(a) as being
unpatentable over Ragard.
Claims 43, 45 and 46 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Ragard in view of Tamano.
Claims 45, 46 and 56 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Ragard in view of Kirsch.
Claims 49 through 51 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Ragard in view of Tamano and Holcomb.
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