Appeal No. 2004-1252
Application No. 09/705,710
a side of the semiconductor die package housing. Independent
claim 43 recites an apparatus for inserting conductive leads into
a substrate for holding a semiconductor die wherein the apparatus
comprises means for simultaneously inserting L-shaped conductive
leads into lead passages in at least two vertically spaced rows
on one of the side walls of the substrate. Independent claim 44
recites an apparatus for inserting conductive leads into a
semiconductor die carrier housing wherein the apparatus comprises
a lead pusher for receiving a supply of conductive leads and
inserting them into lead passages in the semiconductor die
carrier housing.
Each of the rejections on appeal rests on the examiner’s
determination that Ragard teaches, or would have suggested, an
apparatus responsive to these lead pusher and lead inserting
means limitations. Appreciating that these limitations refer to
the housing or substrate into which the leads are to be inserted,
the examiner acknowledges that Ragard’s circuit board 6 does not
constitute a semiconductor die package housing as set forth in
claim 30, a substrate for holding a semiconductor die as set
forth in claim 43 or a semiconductor die carrier housing as set
forth in claim 44. The examiner correctly observes, however,
that the claim language pertaining to the housing or substrate is
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