Appeal No. 2004-1321 Page 10
Application No. 10/002,633
974 F.2d 1309, 1312, 24 USPQ2d 1040, 1042 (Fed. Cir. 1992); Lindemann
Maschinenfabrik GmbH v. American Hoist and Derrick Co., 730 F.2d 1452, 1462, 221
USPQ 481, 488 (Fed. Cir. 1984).
Ashiwake's invention is directed generally to cooling of an appliance, and more
particularly, to heat sinks and a semiconductor cooling device using the heat sinks
suitable for cooling semiconductor chips having a high heat dissipating density or
semiconductor packages. Figure 1 depicts one embodiment of the invention in which a
multiplicity of tabular fins 2 formed with through-holes 1 are laminated via radially
provided spacer member 3, thus forming a heat sink. The through-holes 1 cooperate to
form an axis-directional path 5 for leading a cooling fluid 4 to the central part of the heat
sink. A fin 8 constituting a bottom plate of the heat sink is bored with no through-hole
and serves to blockade the axis-directional path 5. The tabular fins 2 are laminated to
form passageways 7 for flowing the cooling fluids 6 in the radial directions. Figure 8
depicts a second embodiment of the invention in which tabular fins 2 and fin 8 are
formed to have curvatures to assume a spherical surface which causes centrifugal
forces to act on the radial flow along the axis-directional path 5.
In our view, there is no suggestion in the combined teachings of Cermak and
Ashiwake to have modified Cermak's pockets to be spherical as set forth in this
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