Appeal No. 2004-2144
Application No. 09/483,712
using a lead frame as an interposer (Brief, page 3). A further
understanding of the invention may be gleaned from representative
independent claim 1, as reproduced below:
1. A chip-scale package comprising:
a semiconductor die having an active surface having at least one
bond pad thereon;
at least one conductive trace spaced from said at least one bond
pad and having an upper surface and a lower surface, the
lower surface of said at least one conductive trace
substantially non-conductively attached to a portion of the
active surface of said semiconductor die;
at least one discrete conductive bond member connecting the at
least one conductive trace to the at least one bond pad on
the active surface of said semiconductor die;
at least one carrier bond attached to the upper surface of the at
least one conductive trace; and
an encapsulant material encapsulating said semiconductor die, the
at least one conductive trace, the at least one discrete
conductive bond and a portion of the at least one carrier
bond, the at least one carrier bond having another portion
extending beyond said encapsulant material.
Appellants state that the claims do not stand or fall
together (Brief, page 4), contrary to the examiner’s statement
(Answer, page 3, ¶(7); see the Reply Brief, page 2). Since
appellants provide reasonably specific, substantive arguments for
the patentability of individual claims 3, 6, 11, 12 and 14
(Brief, page 9), we consider these claims separately while the
remaining claims stand or fall together. See 37 CFR
2
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