Appeal No. 2005-0088
Application No. 10/160,629
contact areas applied directly to said surface of
said substrate film, said substrate film disposed
between said semiconductor chip and said contact areas
causing said substrate film to electrically connect
said connection points of said semiconductor chip to
said contact areas in a manner of a direct contact and
to mechanically support said at least one semiconductor
chip.
The examiner relies upon the following references as
evidence of obviousness:
Orihara et al. (Orihara) 5,705,852 Jan. 06, 1998
Ikefuji et al. (Ikefuji) 6,404,644 Jun. 11, 2002
(effectively filed Jan. 05, 2000)
Appealed claims 1-7 stand rejected under 35 U.S.C. § 103(a)
as being unpatentable over Orihara in view of Ikefuji.
Appellants submit at page 5 of the brief that claims 1-3
stand or fall together with claim 1, whereas claims 4, 5, 6 and 7
are separately argued.
We have thoroughly reviewed appellants’ arguments for
patentability. However, we are in complete agreement with the
examiner that the claimed subject matter would have been obvious
to one of ordinary skill in the art within the meaning of § 103
in view of the applied prior art. Accordingly, we will sustain
the examiner’s rejection for the reasons set forth in the
2
Page: Previous 1 2 3 4 5 6 Next
Last modified: November 3, 2007