Appeal No. 2004-1914
Application No. 09/739,288
BACKGROUND
The invention is directed to a contactor to be placed between a semiconductor
device and a test board. The contact electrode comprises a first contact piece which
contacts a terminal of the semiconductor device, a second contact piece which contacts
an electrode of the test board, and a connecting portion which electrically connects the
first and second contact piece. Claims 1 and 4 are reproduced below.
1. A contactor which is placed between a semiconductor device and a test board so
as to electrically connect said semiconductor device to said test board, said contactor
comprising:
an insulating substrate; and
a contact electrode formed by etching a conductive layer plated onto said
insulating substrate, the contact electrode comprising a first contact piece which
contacts a terminal of said semiconductor device, a second contact piece which
contacts an electrode of said test board, and a connecting portion which electrically
connects said first contact piece and said second contact piece;
wherein the conductive layer is plated onto the substrate and the contact
electrode is formed by etching portions of the conductive layer off of the substrate; and
wherein both the first contact piece and the second contact piece are movable
contact pieces and are elastically movable by a pressing force applied thereto.
4. The contactor as claimed in claim 1, wherein each of said first contact piece and
said second contact piece is placed so that a longitudinal direction thereof is aligned
with a radial direction from a center of said insulating substrate.
The examiner relies on the following reference:
Boyd et al. (Boyd) 5,139,427 Aug. 18, 1992
Claims 1-4, 14-17, and 20 stand rejected under 35 U.S.C. § 102 as being
anticipated by Boyd.
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