Appeal No. 2005-0277
Application No. 09/883,883
sampling the desorbed volatiles;
generating raw spectral data from the sampled desorbed
volatiles, the raw spectral data indicating the content
of the desorbed volatiles;
performing a spectroscopic analysis of the raw spectral
data; and
modifying an operational parameter of the fabrication tool
responsive to the result of the results of the
spectroscopic analysis.
10. A process for use in fabricating an integrated circuit,
comprising:
receiving raw spectral data representative of the content of
a plurality of volatiles desorbed from a wafer;
processing the raw spectral data to determine the presence
of a residual material on the wafer; and
controlling a process flow operation to reduce the amount of
the residual material on the wafer responsive to the
results of processing the raw spectral data.
In the rejection of the appealed claims, the examiner relies
upon the following references:
Lee et al. (Lee) 5,865,900 Feb. 2, 1999
Egermeier et al. US 2002/0006677 A1 Jan. 17, 2002
(Egermeier)
(U.S. Patent Application Publication)
Appellant's claimed invention is directed to a process that
finds utility in the fabrication of an integrated circuit. The
process entails generating volatiles from a wafer that has
undergone an operation using a fabrication tool, performing a
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