The opinion in support of the decision being entered
today was not written for publication in a law journal
and is not binding precedent of the Board.
UNITED STATES PATENT AND TRADEMARK OFFICE
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
Ex parte GONZALO AMADOR and ROGER J. STIERMAN
Appeal No. 2005-0767
Application No. 09/817,694
ON BRIEF
Before KIMLIN, DELMENDO and PAWLIKOWSKI, Administrative Patent
Judges.
KIMLIN, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1-5,
12, 16 and 17. Claims 13-15 and 18-21 have been withdrawn from
consideration. Claim 1 is illustrative:
1. A method for controlled electroless plating of uniform
metal layers onto exposed metallizations in integrated circuits
positioned on the active surface of semiconductor wafers,
comprising the steps of:
maintaining a plurality of said wafers approximately
parallel to each other at predetermined distances by supporting
an edge of each said wafers between a plurality of support means;
-1-
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