Appeal No. 2005-0767
Application No. 09/817,694
immersing said wafers into an electroless plating solution
flowing in laminar motion at constant speed substantially
parallel to said active surface of said wafers;
rotating each of said wafers at constant speed and
synchronously with each other by turning each of said plurality
of support means; and
creating periodic relative motion in changing directions
between said plating solution and said wafers, thereby uniformly
plating layers onto said exposed metallizations by controlled
electroless deposition.
The examiner relies upon the following reference in the
rejection of the appealed claims:
Shacham-Diamand et al. 5,830,805 Nov. 3, 1998
(Shacham-Diamand)
Appellants' claimed invention is directed to a method for
the controlled electroless plating of uniform metal layers onto
exposed metallizations in integrated circuits. The method
entails, inter alia, using a plurality of support means to
maintain a plurality of wafers parallel to each other when
immersed into an electroless plating solution. The wafers are
rotated at a constant speed by turning each of the plurality of
support means, and relative periodic motion in changing
directions is created between the plating solution and the wafers
to effect uniform plating.
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