Ex Parte Landau et al - Page 4

          Appeal No. 2005-0789                                                             
          Application No. 10/410,000                                                       

          de Nemours & Co. v. Phillips Petroleum Co., 849 F.2d 1430, 1433,                 
          7 USPQ2d 1129, 1131 (Fed. Cir.), cert. denied, 488 U.S. 986                      
          (1988).  Claim 1 recites “comprising”, and this word is an open-                 
          ended word. See, Parmelee Pharmaceutical Co. et al. v. Zink (CA                  
          8 1961) 285 F2d 465, 468, 128 USPQ 271, 275.                                     
                Furthermore, for argument sake, we note that appellants’                   
          specification indicates that the plating solution can have “no                   
          acid”.  See page 5, paragraph 9.  In light of this disclosure,                   
          the claimed phrase of “up to about 0.4M of supporting                            
          electrolyte” can be interpreted as including no supporting                       
          electrolyte.  Under such an interpretation, Bickford also                        
          anticipates claim 1 because Bickford discloses an electroplating                 
          bath having no supporting electrolyte.  See column 18, lines 63-                 
          66.                                                                              
                In view of the above, we therefore affirm the anticipation                 
          rejection claims 1-4, 6, 12, 14, 20, 21, and 23-26 as being                      
          anticipated by Bickford.                                                         
                                                                                          
          II. The 35 U.S.C. § 103 rejection of claims 1-13 and 15-24 as                    
                being obvious over Watson                                                  
                The examiner’s position for this rejection is set forth on                 
          pages 4-5 of the answer.  The examiner’s basic position is that                  
          Watson teaches use of appellants’ plating solution for                           
          electrodepositing copper on a brass panel, and that it would                     
          have been within the skill in the art to employ Watson’s method                  
          would for electrodepositing copper on a semiconditive substrate.                 
          Answer, pages 4-5.                                                               
                Appellants respond to this rejection, on page 5 of the                     
          brief and page 3 of the reply brief.  Appellants essentially                     
          argue that claims 1-13 and 15-24 recite a method of                              
          electrodepositing a metal, such as copper, on a semiconductor                    

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